Integrated acoustic and thermal modulation for optimized 3D metal fabrication
US12208450B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2024 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Jun 27, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2998/10
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
This invention pertains to a system and method for three-dimensional (3D) printing using acoustic modulation to control the flow and solidification of various materials, with integrated thermal management and real-time analytical adjustments. The system addresses the challenges of controlling the solidification process in non-solid states, which can lead to defects. It utilizes acoustic emitters for precise modulation, a material dispensing unit adaptable to various materials, and an advanced control system for synchronization. The method involves material dispensing followed by acoustic modulation to mold the material. Adjustments based on sensor feedback ensure a seamless transition from non-solid to solid states. The system can handle diverse materials and create multi-material objects with tailored properties. Applications include the fabrication of 3D objects with enhanced structural integrity, surface finish, and complex geometries, as well as functionally graded materials and composites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.