Solder materials including supercooled micro-capsules and alloyed particles
US12208471B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Jan 19, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2301/30
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A material includes a plurality of supercooled micro-capsules each including a metallic core in a liquid state at a temperature below a solidification temperature of the metallic core and further includes a metallic shell surrounding each respective metallic core. A plurality of alloyed metallic particles and flux are mixed with the plurality of supercooled micro-capsules to form a solder paste. Upon heating the solder paste, the plurality of alloyed particles melt. As the metallic shells destabilize, the liquid metallic cores interdiffuse with the melted alloyed particles forming a new alloy that has a higher melting temperature than the melting temperature of the alloyed metallic particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.