Microreplicated polishing surface with enhanced co-planarity
US12208483B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2018 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | May 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.