Methods of in-molding labels and dispensers thereof
US12208551B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2020 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Aug 31, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/769
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods for producing a dispenser for dispensable products are disclosed. The method includes attaching a label to the front plate of the dispenser by an in-mold process. The label has a label height (H2) that is less than the front plate height (H1) and label width (W2) that is less than the front plate width (W1) such that a border is formed around at least a portion of the label in the front plate. The front plate can be formed from a transparent material while the label is formed from an opaque material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.