Methods for printing metal lines and patterns at high resolution
US12209304B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2023 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Apr 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solvent layer is coated on a metal layer carried by a donor substrate, allowing the fabrication of solid metal lines at a high resolution. The laser jetting involves ejecting metal particles, constrained within a solvent membrane, from the metal layer. Once the metal particles have been deposited onto a receiver substrate, the solvent can be evaporated. Since this printing procedure can be performed with the solvent layer in direct contact with the receiver substrate or separated therefrom by a small distance, the resolution of the metal lines can be very high and depends directly on the laser spot size and defocus. The solvent constrains the droplet size of the metal particles, which can increase or maintain the resolution of the laser beam. As this process is a continuous sequence production, the metal line production can be performed at a very rapid rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.