Systems and methods for overmolding a card to prevent chip fraud
US12210922B2 · kind B2 · utility
0Cited by
123References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2023 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | May 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/573
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Systems and methods for overmolding a card are provided. A chip fraud prevention system include a device including a chip and a substrate. The chip may be at least partially encompassed in a chip pocket, and the substrate may be at least partially encompassed by the overmold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.