Method for producing a lighting device

US12211826B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Laura Kreiner · Regensburg, DE
• Jens Mueller · Stuttgart, DE

Key dates

• Filing date: Dec 14, 2020
• Grant date: Jan 28, 2025
• Expiry date: Nov 17, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68354
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In an embodiment a method for producing a lighting device includes providing a wafer assemblage having a semiconductor layer sequence arranged on a carrier substrate, separating the wafer assemblage into a plurality of first optoelectronic semiconductor chips, each comprising a section of the semiconductor layer sequence and of the carrier substrate, transferring at least some of the first optoelectronic semiconductor chips to a first auxiliary carrier, wherein the first auxiliary carrier has contact pads on a main surface, wherein the contact pads are surrounded and delimited in each case by a contour, and wherein each of the first optoelectronic semiconductor chips is arranged on a contact pad, cutting, on the first auxiliary carrier, to size the first optoelectronic semiconductor chips in order to adapt the first optoelectronic semiconductor chips to a predefined shape such that the each first optoelectronic semiconductor chip lies completely within the contour of an assigned contact pad, and transferring the first optoelectronic semiconductor chips from the first auxiliary carrier to a carrier.