Single die design for different polarizations
US12212074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Aug 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/065
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated circuit comprising a package, phased antenna array and die. The die comprises a plurality of unit cells, wherein each unit cell is divided into quadrants. Each quadrant comprises a receiver terminal located on a first axis, and a transmitter terminal located on a second axis, wherein the first axis is orthogonal to the second axis, and there is mirror symmetry between the nearest neighbour quadrants in the unit cell. The package comprises a plurality of pairs of feed lines, each pair of feed lines comprising a receiver feed line and a transmitter feed line. The receiver feed line is connected to one of the receiver terminals and the transmitter feed line is connected to the transmitter terminal in the same die quadrant. The receiver feed line is orthogonal to the transmitter feed line. Each antenna element is coupled to a respective pair of feed lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.