Miniaturized high speed connector
US12212100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Apr 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R25/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector for use with high speed signals. The connector may include lead frame assemblies in a connector housing. A lead frame assembly may include signal conductive elements and ground conductive elements disposed in a repeating pattern, and one or more corrugated sheets attached to the ground conductive elements. The corrugated sheets may extend more than half of the length of the signal conductive elements. Valleys of the corrugated sheets may be welded to the ground conductive elements with line welds. The line welds may extend over a large percentage of the length of the conductive elements. Such a configuration enables accurately and repeatedly establishing signal to ground spacing and therefore promotes high signal integrity, even for miniaturized connectors. Such a connector may be used to meet signal integrity requirements in connectors designed for 112 GBps and beyond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.