Piezoelectric microelectromechanical system corrugated microphone
US12212925B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Dec 26, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A piezoelectric microelectromechanical system microphone comprises a support substrate, a piezoelectric element configured to deform and generate an electrical potential responsive to impingement of sound waves on the piezoelectric element, the piezoelectric element attached to the support substrate about a perimeter of the piezoelectric element, a sensing electrode disposed on the piezoelectric element and configured to sense the electrical potential, and corrugations defined in the piezoelectric element about the perimeter of the piezoelectric element to release residual stress and improve sensitivity of the piezoelectric microelectromechanical system microphone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.