Apparatus, system, and method for implementing multipurpose screw holes in circuit packaging for mobile devices
US12213241B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2023 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Aug 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit package may comprise (1) a substrate, (2) at least one radio frequency (RF) circuit disposed on the substrate, and (3) a plurality of screw holes that are incorporated into the substrate and configured to support mounting the substrate to an enclosure, wherein at least one of the screw holes is further configured to provide at least one supplemental function in connection with the RF circuit. Various other apparatuses, systems, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.