Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board
US12213249B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | May 11, 2021 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Apr 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0266
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding. A mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater. An average particle diameter of the silica is 0.1 μm or greater but 3.0 μm or less. A reduction ratio of the extrusion molding is 8 or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.