Processor load plate for two-phase liquid immersion cooling
US12213278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Feb 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/44
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An information handling system may include a motherboard, an information handling resource, a heat spreader thermally coupled to the information handling resource, and a load plate mechanically coupled to the motherboard in order to maintain electrical and mechanical coupling of the information handling resource to the motherboard. The load plate may include a body at least partially overlapping with and mechanically coupled to the heat spreader when the load plate is mechanically coupled to the motherboard, an opening formed within the body and configured to expose the heat spreader through the opening when the load plate is mechanically coupled to the motherboard, and an angled feature formed at one edge of a perimeter of the opening and decreasing in depth from the opening to the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.