Conduction cooled chassis
US12213285B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2022 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Mar 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1418
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.