Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips
US12213288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2020 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | May 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus is described. The apparatus includes a liquid cooling system having multiple heat-exchangers and multiple valves. The multiple valves are to enable/disable participation of individual ones of the heat-exchangers within the liquid cooling system. The apparatus includes an information keeping device to store information that correlates a number of the multiple heat exchangers to be enabled to realize one or more semiconductor chips' target temperature for a power consumption of the one or more semiconductor chips for a plurality of combinations of target temperature and power consumption. The controller is coupled to the liquid cooling system and the information keeping device to dynamically determine during runtime of a system having the one or more semiconductor chips an appropriate number of the multiple heat exchangers to enable to realize a particular target temperature for the one or more semiconductor chips for a particular power consumption of the one or more semiconductor chips, and, update the information in the information keeping device with a new correlation that correlates the appropriate number with the particular target temperature and particular power co…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.