Injection molding warp prediction
US12214534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jul 6, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/14
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and apparatus, including medium-encoded computer program products, for injection molding warp prediction include: obtaining a mold model and measured shrinkage data for at least one material, predicting an amount of warpage for a part manufactured using the mold by computational simulation of an injection molding process, where the computational simulation uses an internal residual stress model for the part that uses calibrated values for both a coefficient of thermal expansion and an elastic modulus and/or a Poisson's ratio of the at least one material, in at least one direction, for at least thermal stress due to cooling and pressure compensation during and/or after a packing phase of the injection molding process, in accordance with the measured shrinkage data for the at least one material, and providing the amount of warpage predicted for the part manufactured using the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.