Patent · US Active

Method for transferring a layer to a substrate

US12214580B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignees

IMEC VZW · BE
Katholieke Universiteit Leuven, KU LEUVEN R&D · BE

Inventors

Boshen Liang · Herent, BE
Dominika Wysocka · Leuven, BE
David Cheyns · Heffen, BE

Key dates

Filing date	Jun 7, 2022
Grant date	Feb 4, 2025
Priority date	—
Expiry date	Jun 7, 2042

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0785
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.