Patent · US Active

Package, spout for a package and package-spout assembly

US12214942B2 · kind B2 · utility

0Cited by
5References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateNov 7, 2019
Grant dateFeb 4, 2025
Priority date
Expiry dateJun 29, 2041

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02W30/80
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

There is described a package-spout assembly having a package having a pour opening surface area and a reusable spout. The package comprises a first fastening device being arranged adjacent to the pour opening surface area and the spout comprises a second fastening device. The first fastening device and the second fastening device are configured such to removably and/or releasably couple the spout onto the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.