Microelectromechanical microphone with reduced overall size
US12215022B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jun 14, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical microphone including a microphone unit made from a first substrate, the microphone unit including a movable element capable of being displaced under the effect of a pressure difference and a device for measuring the displacement of the movable element, a cover made from a second substrate, the cover having a first recess, first device for electrically connecting the measurement device to a control unit, the microphone unit and the cover delimiting between them a vacuum space housing the measurement device and a first cavity, from the first recess, partly closed by the movable element, the vacuum space and the first cavity being insulated in a sealed manner from each other, the microphone including a device for mechanically transmitting the displacement of the movable element to the measurement device and a sealed insulation element through which the transmission device passes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.