Photonic wafer level testing systems, devices, and methods of operation
US12216020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/2932
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.