Methods and systems for printed circuit board component placement and approval
US12216975B2 · kind B2 · utility
0Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2023 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Dec 28, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/168
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An aspect of the disclosed embodiments is a method for printed circuit board (PCB) component placement comprising: graphically displaying, on a display device, PCB design features of a PCB design; and providing a user interface control for designating one or more of the PCB design features as electrical contacts for a first selected electrical component. Other aspects are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.