Lead-frame, card body of a smart card, smart card, and method of forming a smart card
US12217114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jul 11, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07743
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In various aspects, the present invention relates to a lead frame for integration into a smart card, a card body of a smart card, a smart card, and a method of forming a smart card. In an aspect of the present disclosure, a lead-frame for integration into a smart card is provided comprising a planar lead-frame body portion, at least one contact pad having a planar contact portion, and at least one bridging portion coupled with the planar lead-frame body portion and extending away from the planar lead-frame body towards the at least one contact pad and between the planar contact portion and the planar lead-frame portion, wherein the at least one bridging portion extending out of a plane defined by at least one of the planar lead-frame body portion and the planar contact portion and at least partially in parallel to a substantially normal direction of the planar contact portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.