Etching device and etching method using the same
US12217978B2 · kind B2 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Aug 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/231
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etching device includes a nozzle unit including at least one nozzle including an etching solution injection hole, an etching solution collection hole, and a sealing part. The etching solution injection hole is configured to provide an etching solution to an etching object, the etching solution collection hole is configured to collect the etching solution, and the sealing part surrounds the etching solution injection hole and the etching solution collection hole to prevent the etching solution from leakage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.