Conveying device
US12217996B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2020 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Feb 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/677
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This conveying device 1 comprises: a chuck 2 that contactlessly holds a semiconductor chip 103 to face a holding surface 2B; and a guide 3 that has a guide probe 9 capable of abutting a chip side surface 103s of the semiconductor chip 103, and for the semiconductor chip 103 held by the chuck 2, the guide probe 9 limits the movement of the semiconductor chip 103 in the lateral direction which intersects a normal N to the holding surface 2B. The guide probe 9 is capable of reciprocating movement in which a probe tip 9a moves towards and away from the holding surface 2B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.