Electronic module comprising a semiconductor package with integrated clip and fastening element

US12218030B2 · kind B2 · utility

Assignee

• Infineon Technologies Austria AG · AT

Inventors

• Edward Fuergut · Nuremberg, DE
• Peter Eibl · Pirkensee, DE
• Horst Groeninger · Maxhütte-Haidhof, DE
• Martin Gruber · Schwandorf, DE
• Christian Kasztelan · Munich, DE
• Philipp Seng · Munich, DE

Key dates

• Filing date: Mar 12, 2020
• Grant date: Feb 4, 2025
• Expiry date: Mar 12, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/32245
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.