Interposer, semiconductor package including the same, and method of fabricating the interposer
US12218043B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Nov 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an interposer for a semiconductor package, the interposer including an interposer substrate comprising a first main surface and a second main surface opposite to the first main surface, a first through-electrode structure and a second through-electrode structure each passing through the interposer substrate and protruding from the first main surface, a connection terminal structure contacting both the first through-electrode structure and the second through-electrode structure, and a photosensitive polymer layer arranged between the connection terminal structure and the interposer substrate, and between the first through-electrode structure and the second through-electrode structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.