Micro LED display and manufacturing method therefor
US12218295B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 29, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Dec 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various embodiments of the disclosure disclose a method for manufacturing a micro Light Emitting Diode (LED) display. The disclosed manufacturing method may include coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles, attaching an array of micro LED chips on the polymer adhesive solution, physically connecting a connection pad for each of the array of micro LED chips to the metal particles through heating and pressing the attached plurality of micro LED chips to descend through the polymer adhesive solution, and chemically bonding the metal particles to the connection pad and the circuit portion through heating and pressing so that the micro LED chips are electrically connected to the circuit portion. Various other embodiments are also possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.