Photonic integrated circuits with controlled collapse chip connections
US12218479B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jul 19, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Feb 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments are directed to a photonic device that includes a first substrate defining a surface and a trench forming a depression along a portion of the surface, and a second substrate coupled with the surface and extending from the surface to form a raised portion around the trench. The photonic device can also include a laser die positioned within the trench, such that the laser die is surrounded by the second substrate, and an optical material positioned within a region between the laser die and the second substrate. The photonic device can further include a third substrate coupled with the second substrate such that the second substrate is positioned between the first substrate and the third substrate such that the second substrate is configured to at least partially isolate the laser die from mechanical stress exerted on the optical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.