Large image sensor package
US12219231B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jan 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/18
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an image sensor package including a printed circuit board, an image sensor electrically coupled to the printed circuit board, a sealing configuration coupled to a front face of the printed circuit board via a first gasket, and a base coupled to a back face of the printed circuit board via a second gasket. Electronic components embedded on the back face of the printed circuit board align with and connect to mating pads surrounding the image sensor on the front face of the printed circuit board. Wire bonds electrically connect the image sensor to the mating pads and the electronic components. The sealing configuration includes a cover attached to a frame surrounding the image sensor. A gap separates the image sensor from abutting the surrounding printed circuit board, which is coupled to the image sensor via the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.