Printed circuit board assembly with integrated vapor chamber
US12219691B2 · kind B2 · utility
1Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Jul 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly comprises: a printed circuit board (PCB); an integrated circuit (IC) package that is mounted on the PCB and includes a first surface and a bare IC die disposed on the first surface; and a vapor chamber coupled to the first surface of the IC package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.