Circuit board assembly and electronic device
US12219727B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2022 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Aug 18, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.