Element-mounted board and method for manufacturing element-mounted board
US12219739B2 · kind B2 · utility
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4References
6Claims
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Key dates
| Filing date | Mar 11, 2021 |
| Grant date | Feb 4, 2025 |
| Priority date | — |
| Expiry date | Sep 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.