Feedthrough assembly and device including same
US12220590B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2023 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Mar 22, 2043 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/3756
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.