Chemical mechanical polishing pad and preparation thereof

US12220784B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Bainian Qian · Newark, US
• Robert Blomquist · River Edge, US
• Lyla M. El-Sayed · West Chester, US
• Michael E. Mills · Midland, US
• Kancharla-Arun Kumar Reddy · Wilmington, US
• Bradley K. Taylor · West Chester, US
• Shijing Xia · Hockessin, US

Key dates

• Filing date: Oct 13, 2021
• Grant date: Feb 11, 2025
• Expiry date: Mar 17, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/30625
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.