Thermal head
US12220927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jan 24, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3358
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An embodiment of the present invention is a thermal head including: a heat dissipation plate having a first surface of a substantially rectangular shape in a plane view, and a second surface that is on an opposite side to the first surface; a board attached to the heat dissipation plat in such a manner as to extend from the first surface to the second surface, via a first end part interposed between the first surface and the second surface; a heating part having a plurality of heating elements, the heating part being disposed on the board over the first surface; and surface-mount devices mounted on the board over the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.