Propylene-based resin composition and film for heat sealing
US12221532B2 · kind B2 · utility
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Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Mar 27, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/064
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A propylene-based resin composition including an impact polypropylene component (A), and a linear low-density polyethylene component (B) containing methylpentene as a comonomer, the composition being characterized by containing a xylene-soluble fraction in an amount of 8 mass % or higher, and having an intrinsic viscosity measured for the xylene-soluble fraction is in a range from 1.0 to 2.9 dL/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.