Hot melt adhesive composition
US12221561B2 · kind B2 · utility
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4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2018 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Dec 26, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2425/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot-melt adhesive composition includes a styrene-butadiene-styrene triblock copolymer and a styrene-isoprene-styrene triblock copolymer. The hot-melt adhesive composition enables melt processing at a relatively low temperature because of having a low viscosity properties are property and thus exhibits excellent adhesive strength and heat resistance while improving the processability. In particular, the melt adhesive composition has excellent mechanical properties after curing, and thus can be used in various industrial fields.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.