Bonded structure
US12221565B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Apr 21, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/312
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A bonded structure includes a first bonded member having a first bonding surface, a second bonded member having a second bonding surface, and a bonding layer that bonds the first bonding surface and the second bonding surface. The bonding layer includes a stress relaxation layer containing a chain polymer, a first bonded molecular layer containing a first bonded molecule bonded to the first bonding surface, and a second bonded molecular layer containing a second bonded molecule bonded to the second bonding surface. A first end of the chain polymer is bonded to the first bonded molecule via a first binding molecule or without bonding via the first binding molecule. A second end of the chain polymer is bonded to the second bonded molecule via a second binding molecule or without bonding via the second binding molecule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.