Housing for flow-conducting components
US12221978B2 · kind B2 · utility
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3References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jul 26, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A method for forming a housing for a flow-conducting component includes forming at least two functional regions of the housing having different material properties using at least one of radiation-induced melting and solidification of a build material and a process gas jet. Each functional region of the housing may be generated from a different construction material, and at least one functional layer may be formed with a reduced weight structure such as a honeycomb structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.