Display substrate with a bonding pad including conductive parts in different layers and method for manufacturing the same, display device
US12222596B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jul 17, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136209
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A display substrate, a method for manufacturing a display substrate and a display device are provided. The display substrate has a display area and a bonding area. The display substrate includes a base, a first conductive layer, a light shielding layer, and bonding pads. The first conductive layer is on the base and in the display area, and the first conductive layer includes gate lines; the light shielding layer is on a side of the first conductive layer proximal to the base, and an orthographic projection of the light shielding layer on the base at least covers orthographic projections of the gate lines on the base; the bonding pads are on the base at intervals and in the bonding area, orthographic projections of at least a portion of the bonding pads on the base are not overlapped with the orthographic projection of the light shielding layer on the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.