Heating system using heat extracted from a computer processing unit
US12222781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Nov 20, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/52
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Computer processing systems are cooled and the otherwise wasted heat is extracted for space heating by providing a cooling dielectric liquid in a tank which passes from a manifold at the bottom of the tank through an array of tubular housings each having open top and bottom ends and containing row of the circuit boards. The housings sit on a divider sheet which has arrays of openings aligned with the housings allowing the liquid to pass from the manifold under little or no pressure so that the liquid flows through the housings by convection and stratifies to generate a layer of heated liquid above the open tops of the housings which can be tapped off to a heat exchanger. A heat pump acts on the cooling liquid to transfer heat to a heat transfer liquid which can be further heated by a boiler and transferred to existing heat dissipating loads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.