Virtual environment for implementing integrated photonics assemblies
US12223245B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Apr 29, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Apr 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for generating a virtual environment for implementing an integrated photonics assembly are presented. An example system can include one or more processors and a memory coupled with the processors, where the processor executes a plurality of modules stored in the memory. The plurality of modules can include a user interface module for deploying one or more virtual photonic integrated subcircuits within the virtual environment, in which the virtual environment is configured to enable coupling of at least two virtual photonic integrated subcircuits. The coupling of the virtual photonic integrated subcircuits can form a virtual integrated photonics assembly. The modules can include a library module comprising a plurality of virtual photonic integrated subcircuits. One or more virtual photonic integrated subcircuits can include a performance characteristic. The performance characteristic can represent a real-world performance characteristic of a pre-fabricated physical photonic integrated subcircuit corresponding to the virtual photonic integrated subcircuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.