Screen module, display assembly, and electronic device
US12223870B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Feb 10, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A screen module uses a bendable display panel including a first panel layer and a second panel layer. A support layer is located between the first panel layer and the second panel layer. The first panel layer and the second panel layer are connected by a bent region, and a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer. A projection of the first region of the support layer on the first panel layer overlaps with a projection of a display driver chip on the first panel layer. After being stacked, the thickness of the screen module may be reduced to meet the user's requirement for a small thickness of an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.