Package substrate and semiconductor structure with same
US12224244B2 · kind B2 · utility
0Cited by
15References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 24, 2022 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | May 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/49816
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a package substrate and a semiconductor structure with the same. The package substrate includes a body and a plurality of conducive bridges. The body includes an opening region. The plurality of conductive bridges are disposed separately in the opening region, and adjacent conductive bridges have a respective distance value. At least two of the distance values are not equal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.