Flexible hybrid electronic system processing method and flexible hybrid electronic system
US12224246B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2021 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Jun 19, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing method of a flexible hybrid electronic system is provided and includes the following steps: etching out embedded grooves on a front surface of a silicon-based substrate embedding a plurality of heterogeneous chips into corresponding embedded grooves, wherein front surfaces of the embedded chips are flush with the front surface of the silicon-based substrate; then gradually realize the polymer flexible connection, electrical interconnection, insulation protection, and polymer flexible coverage between chips. The processing method processes the flexible hybrid electronic system based on the method of embedding chips, which can reduce material loss and processing steps, and is beneficial to realizing large-scale manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.