Optoelectronic modules including an optical emitter and optical receiver
US12224385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Oct 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.