Manufacturing method of a composite substrate of an acoustic wave resonator
US12224730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2020 |
| Grant date | Feb 11, 2025 |
| Priority date | — |
| Expiry date | Oct 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/25
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a composite substrate for manufacturing an acoustic wave resonator and a Surface Acoustic Wave (SAW) resonator, and a manufacturing method thereof. The manufacturing method of the composite substrate includes: providing a base, wherein the base includes a first surface and a second surface that are opposite to each other; and a first groove sunken towards the second surface is formed on the first surface; and providing a piezoelectric plate, wherein the piezoelectric plate is matched with the first groove in shape, and a bottom of the first groove is integrated with the piezoelectric plate by bonding; and the composite substrate includes: a base, wherein the base includes a first surface and a second surface that are opposite to each other; and a first groove sunken towards the second surface is provided on the first surface; and a piezoelectric plate, wherein the piezoelectric plate is embedded into the first groove, and a top of the piezoelectric plate is higher than the first surface or flush with the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.