Patent · US Active

Cooling system for the liquid immersion cooling of electronic components

US12225689B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

WIELAND-WERKE AG · DE

Inventors

Achim Gotterbarm · Blaustein, DE
Manfred Knab · Blaustein, DE
Jochen Dietl · Ulm, DE
Harald Gaibler · Neudorf, DE

Key dates

Filing date	Mar 30, 2021
Grant date	Feb 11, 2025
Priority date	—
Expiry date	Dec 18, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG06F2200/201
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A cooling system for the liquid immersion cooling of electronic components. The system includes a container containing, in an interior, liquid heat transfer fluid into which electronic components are immersed, the container having a gas space above the surface of the liquid heat transfer fluid, and a heat exchanger device in the gas space of the container for forming liquid heat transfer fluid. The cooling system further includes a lock device on the container for exchanging electronic components, and the lock device has a lock space, which lock space is hermetically sealed with respect to the gas space of the container to prevent gas exchange.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.