Debondable adhesives and uses thereof
US12225972B2 · kind B2 · utility
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1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2023 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Aug 17, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/502
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Debondable adhesive compositions are provided. This disclosure also provides articles of footwear and components for articles of footwear including a debondable adhesive matrix. The debondable adhesive matrix can allow for the bonding and debonding of two substrates in the article of footwear or component thereof. This disclosure also provides methods of making the debondable adhesive compositions and methods of using said compositions for bonding and debonding the substrates, e.g. for bonding and debonding of an upper and an outsole in an article of footwear.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.