Method to manufacture cuff leads
US12226628B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2021 |
| Grant date | Feb 18, 2025 |
| Priority date | — |
| Expiry date | Jun 11, 2043 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/0556
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of manufacturing an implantable lead including a cuff is disclosed. The method includes partially curing a first silicone electrode cover, embedding electrodes within the first silicone electrode cover, partially curing a second silicone electrode cover, placing the first silicone electrode in a face-to-face relationship with the second silicone electrode cover to form an assembly, forming the assembly into a desired shape against a shim, placing an assembly within a canister to control an outer expansion, and curing the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.